Spatial Atomic Layer Deposition for Low Temperature Thin Film Encapsulation

Spatial Atomic Layer Deposition for Low Temperature Thin Film Encapsulation

Heeyeop Chae
Sungkyunkwan University

Spatial atomic layer deposition (ALD) process was developed for moisture barrier films at low temperature below 100°C. Nanometer level metal oxides and organic layers were deposited in spatial atomic layer deposition. Nanometer scale organic layers were also deposited to increase moisture resistance and flexibility in the same spatial ALD chamber with organic precursors of cyclohexane, benzene, and fluorocarbon compounds.